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Inpria logo

Inpria

Recent Finacing

Series C

Recent Raise

$31M

Inpria develops tin-oxide metal-oxide photoresists and photo-condensed molecular oxides for EUV lithography, offering high-resolution, high-etch-selectivity patternable hardmasks to simplify pattern transfer for 7nm+ semiconductor manufacturing.

Founded 2007
Oregon, United States
11-50
Private
inpria.com

Highlights

Focus Areas

Electronics
Manufacturing
Semiconductor

Recent Investors

Intel Capital logo
Applied Ventures logo
Air Liquide Venture Capital logo
Samsung logo
JSR Corporation logo
Taiwan Semiconductor logo
SK Hynix logo
Samsung Ventures logo
Oregon Venture Fund logo
Tokyo Ohka Kogyo logo

Financials

$60.6M

Total Raised

5

Funding rounds

10

Investors


Team

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See the team members at Inpria.