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Huafeng Jixin

Recent Finacing

Hybrid A

Recent Raise

$376.3M

Huafeng Jixin is a Beijing-based semiconductor company specializing in high-end 2.5D/3D advanced chip packaging for AI, GPU and CPU applications.

PitchBook

Highlights

Recent Investors

B
N
广发信德 logo
Postal Savings Bank of China logo
Z
Z
C
Agricultural Bank of China logo
China Construction Bank logo
Bank of China logo

Financials

$376.3M

Total Raised

1

Funding round